Heat dissipation aluminum design, dual combined heat dissipation system
Derived from the high pursuit of performance, it adopts full-size aluminum design, combined with high-strength heat-resistant silicone, which completely covers all heating components, realizes direct-touch heat dissipation, efficient heat control and full-speed reading and writing.
Reliable 3D NAND particles with strength
Selected 3D NAND particles, well tested by a variety of high-end professional instruments, high-density and high-capacity vertical stacking 3D structure tower with main control LDPC error correction mechanism, greatly improving the stability of data transmission, with white custom PCB, absolute belief.
Capacity: 1000GB / 932GB
Interface: M.2 PCIe 4.0 x4
Main control: Phison PS5016-E16
Flash type: 3D NAND Flash
Size: 80*23.6*10mm (with vest)/80*22*1.35mm（PCBA）
Connection read speed: up to 4900 MB/s (CDM)
Connection Write Speed: Up to 4400 MB/s (CDM)
Random Read Speed: Up to 530,000 IOPS (IOmeter)
Random Write Speed: Up to 820,000 IOPS (IOmeter)
Features: White customized PCB, screen printing exclusive HOF series logo
System Support: Windows OS; Mac OS; Linux